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J std 020d

FP1208 Series High Frequency High Current Power Inductors

Table 2 Reflow Profiles (per Jedec J-STD-020D

IPC/JEDEC J-STD-020D.1 - March 2008 IPC/JEDEC J-STD-020D - August 2007 IPC/JEDEC J-STD-020C - July 2004 IPC/JEDEC J-STD-020B - July 2002 IPC/JEDEC J-STD-020A - April 1999 J-STD-020 - October 1996 JEDEC JESD22-A112 IPC-SM-786A - January 1995 IPC-SM-786 - December 1990 Am häufigsten wird der Standard J-STD-020 (engl. Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mounted Devices) der amerikanischen Organisation JEDEC verwendet. Für die Handhabung, Verpackung, Transport und den Einsatz feuchteempfindlicher (SMD-)Bauteile siehe J-STD-033c

Find the most up-to-date version of IPC/JEDEC J-STD-020 at Engineering360

Moisture sensitivity of plastic-encapsulated ICs

Moisture Sensitivity Level - Wikipedi

  1. Environmental Resistance to soldering heat J-STD-020D Table 5-2 Pb-free devices (2 cycles max) Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). I
  2. IPC/JEDEC J-STD-020D.1 March 2008 IPC/JEDEC J-STD-020D August 2007 IPC/JEDEC J-STD-020C July 2004 IPC/JEDEC J-STD-020B July 2002 IPC/JEDEC J-STD-020A April 1999 J-STD-020 -October 1996 JEDEC JESD22-A112 IPC-SM-786A -January 1995 IPC-SM-786 -December 1990 IPC/JEDEC J-STD-020E Moisture/Reflow for Nonhermetic Surface Mount Device
  3. IPC/JEDEC J-STD-020D Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices A joint standard developed by the IPC Plastic Chip Carrier Cracking Task Group (B-10a) and the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices Users of this standard are encouraged to participate in th
  4. title document # date; joint ipc/jedec standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices: j-std-020
  5. . 150 °C. Maximum Temperatur T S max. 200 °C. Duration T S
  6. ) - Temperature Max (Tsmax) -Tmie (t S) 150 °C 200 °C 60-120 seconds Time maintained above: - Temperature (TL.

J-STD-020D.01: Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for non- hermetic solid state surface-mount devices; IPC-TM-650: Test Methods Manual. Section 1.0: Reporting and Measurement Analysis Methods; Section 2.1: Visual Test Methods; Section 2.2: Dimensional Test Methods ; Section 2.3: Chemical Test Methods; Section 2.4: Mechanical Test Methods; Section 2.5. IPC JEDEC-J-STD-020E - 2015-02-03. Jetzt informieren! Damit wir unsere Webseiten nutzerfreundlicher gestalten und fortlaufend verbessern, verwenden wir Cookies Die Umstellung auf RoHS-konforme Baugrppenfertigungen ist eine Herausforderung für Produzenten und Anwender von Halbleitern. Neben bereits eingeführtem NiPd(Au) behauptet sich auch rein Zinn für Lotoberflächen bedrahteter Komponenten und SnAgCu-Lotkugeln für BGAs. Die gute Lötbarkeit dieser Anschlüsse ist sowohl mit SnPb als auch SnAgCu-Loten gegeben

IPC/JEDEC J-STD-020D-1-2008 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices - June 2007. www.ipc.org and www.jedec.org 199.48 KB pd

This is information on a product in full production. March 2016 DocID025755 Rev 5 1/40 M24C02-A125 Automotive 2-Kbit serial I²C bus EEPROM with 1 MHz cloc

IPC/JEDEC J-STD-020 - Moisture/Reflow Sensitivity

  1. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies. In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage
  2. von Dr. Friedrich Wilhelm Wulfert, Freescale EPP (Environmentally Preferred Products) beschreibt die Umweltfreundlichkeit von elektronischen Bauteilen, die zugleich RoHS ‐ konform und lötwärmebeständig sind
  3. JC-10: Terms, Definitions, and Symbols (17) Apply JC-10: Terms, Definitions, and Symbols filter JC-11: Mechanical Standardization (600) Apply JC-11: Mechanical Standardization filter JC-13: Government Liaison (36) Apply JC-13: Government Liaison filter JC-14: Quality and Reliability of Solid State Products (153) Apply JC-14: Quality and Reliability of Solid State Products filte
  4. jedec j-std-020d.01. march 2008 joint ipc/jedec standard for moisture/reflow sensitivity classification for nonhermetic solid state surface-mount device
  5. Supersedes: IPC/JEDEC J-STD-020D.1 March 2008. Users of this standard are encouraged to participate in the development of future revisions. IPC/JEDEC J-STD-020D August 2007 IPC/JEDEC J-STD-020C July 2004 IPC/JEDEC J-STD-020B July 2002. Contact: JEDEC. IPC/JEDEC J-STD-020A April 1999. Solid State Technology Association. J-STD-020 -October 199

IPC/JEDEC J-STD-020E-2015 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices. IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow. Automating Solder Reflow Simulation per IPC/JEDEC J-STD-020D.1 Introduction The purpose of this paper is to demonstrate the reflow soldering process on Surface Mount Devices (SMD) per IPC / JEDEC J-STD-020D.1. SMD suppliers subject their products to this test for classification and preconditioning (JESD22-A113F) purposes. This standard requires SMDs to be reflowed three (3 IPC/JEDEC J-STD-020D-1-2008 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended. Moisture sensitivity test(J-STD-020D). The electrical characteristics and visual conditions before/after the test are also conformed to the failure criteria. However, to be considered various results in each usage conditions, we kindly ask you to check the propriety of the usage in your side

Figure 3. TI Representation of a J-STD-020D.1 Lead-Free Reflow Profile The Classification Reflow Profiles table from J-STD-020D.1 defines the industry standard for a lead-free reflow profile that applies to TI power modules during manufacturing as shown in Figure 3. Important items defined in J-STD-020D.1 that can impact IC reliability are MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions MSL LEVEL. TIME. CONDITIONS. MSL-1. Unlimited ≤ 30°C/85% RH. MSL-3. 168 hours ≤ 30°C/60% RH. PLEASE NOTE: Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or.

Note: Meet JEDEC J-STD-020D Characteristics : Functional temperature range: -25~85℃ Operating temperature range: -10~65℃ (Fusing time <1min) Test temperature range: 25 ± 5℃ Ambient condition Relative humidity: 45~85% Air Pressure: 86~106kPa The parameters do comply to J-STD-020D. Will there be a restriction to the storage time after the convertion? There will be no difference. Does RoHS conform automatically that the components are processable RoHS conform? A general lead free processability is not guaranteed because of the RoHS conformance. Nevertheless, Wurth Elektronik can guarantee the processability in the lead free. Reliability Test . Reference Specs. Purpose. Conditions. Solder Heat Resistance Test (SHRT) JEDEC JESD22-A113

Mobile Personal, portable, connected. Smartphones and tablets continuously transform our connection with the world. See how we drive low power innovation in Mobile J-STD-020D.1, JEDEC, March 2008 A joint IPC/JEDEC standard on the moisture/reflow classification of SMD devices. Though oft cited, note that the standard prescribes the profile in section 5.6 for the purpose of classification of components. It is not necessarily suitable as a production profile. In particular, the recommended hold time of the temperature above liquidus of 60 to 150 seconds, is.

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Video: Standards & Documents Search JEDE

Informationen zum Reflow-Lötverfahren: W+P Online Katalo

  1. e what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation
  2. Note: The package is compliant to IPC/JEDEC J-STD-020D June 2007 standard Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, MSL Level 3. STA710 VFQFPN-64 (9x9x1.0mm) package information DB3858 - Rev 2 page 5/7. Revision history Table 5. Document revision history Date Version Changes 26-Feb-2019 1 Initial release. 25-Nov-2019 2 Updated Figure 1. Block.
  3. IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. J-STD-075 J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. IPC.
  4. als: Finish - Bright Tin. Plated Leads Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Ordering Information: See Page 2 Marking: Type Number Weight: 0.30 grams (Approximate) Dim DO-41 Plastic Min Max A 25.40 B 4.06 5.21 C 0.71 0.864 D 2.00 2.72 All Dimensions in mm Maximum Ratings and Electrical Characteristics (@T A = +25°C.
  5. Reflow nach Jedec J-STD-020D-01 Ersatzteilversand - Reparatur .Fragen und Antworten von User zu User zu allen elektrischen und elektronischen Geräte
  6. imum TS

Design for Manufacturing (DfM) Best Practices Ansy

Reflow Temperature Profile (MEMS Oscillators) The solder reflow profile shown in following figure is IPC/JEDEC J-STD-020 compliant and applies to all KDS MEM 28 August 2008 Specification for monolithic crystal filter: M Q F 2 1 . 4 - 4 0 0 0 / 1 3 1. General 1.1. Package: Reflow profil corresponding to IPC / JEDEC J-STD-020 102 Updated to JEDEC standard J-STD-020D for the moisture sensitivity level and added solder temperature parameter according to the same standard. Subject to Agreement on the Use of Product Informatio Ipc J Std 020d moisture reflow sensitivity classification for nonhermetic, j std 033 , supersedes ipc jedec j std 020d august 2007 joint industry, wave solder exposure of smt packages ti com, plastic package reliability computer action team, basic board mount pressure sensors 32305128 abp series, silicon pin photodiode vishay, high efficiency deep red 660nm led emitter lz1 00r202, , apl1117. Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely used reflow soldering using a forced convection oven is recommended

IPC JEDEC-J-STD-020E - 2015-02-03 - Beuth

  1. ROHM Tantalum chip capacitor satisfies level 3 of above moisture absorbent test(J-STD-020D), and satisfies ROHM abnormality judgment standard with appearance condition check and electrical characteristic check in the vicinity of testing. However ,please review the problem on actual usage at your end because varies result could be considered on each condition. Moisture Sensitivity Level Produc
  2. Due to its low moisture absorption combined with an extremely high stiffness, it classifies for the second best moisture level according to IPC/JDEC J-STD 020D. Green thermoplastics When these mediums are tested to J-STD 004, no halides are found
  3. J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum p
  4. Moved Permanently. The document has moved here
  5. IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices A joint standard developed by the JEDEC JC-14.1 Committee o
  6. JOINT INDUSTRY STANDARD StandardforHandling, Packing,Shippingand UseofMoisture/Reflow SensitiveSurface MountDevices IPC/JEDECJ-STD-033 MAY 199
  7. a 350.

The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflw and process sensitive devices that have been classifid to the levels defied in J-STD-020 or J-STD-075 Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01. Version 1.2 GW P9LT31.CM Taping 9) page 23 Gurtung 9) Seite 23 2017-11-29 17. Version 1.2 GW P9LT31.CM Tape dimensions [mm] Gurtmaße [mm] Tape dimensions in mm Reel dimensions [mm] Rollenmaße [mm] Reel dimensions in mm Tape and Reel Gurtverpackung 12 mm tape with 1500 pcs. on ∅ 180 mm reel W P0 P1 P2 D0 E F 12 + 0.3 / - 0.1 4. JEDEC J-STD-020D.01 $ 62.00 $ 31.00. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES standard by JEDEC Solid State Technology Association, 03/01/2008. Add to cart. Category: JEDEC. Description Description. Resistance to soldering heat +260 °C, 40 s as referenced in JEDEC J-STD 020D Climatic category 55/150/56 (to IEC 60068-1) Storage conditions Mounted: -55 °C +150 °C Packaged: -25 °C +40 °C, d 75% RH Weight Approx. 0.4 g SMT power inductors B82462G4 Size 6.3 x 6.3 x 3.0 (mm) 5 09/19 Please read Cautions and warnings and Important notes at the end of this document.

process according IPC J-STD-020D.1 Available in tape and reel package Bears washing process 3-year product warranty Ordercode Input voltage range Output voltage Output current max. Efficiency typ. TES 2N-0510 3.3 VDC 500 mA 70 % TES 2N-0511 5 VDC 400 mA 73 % TES 2N-0512 4.5 - 9.0 VDC 12VDC 165 mA 75 JEDEC J-STD-020D.01 $ 62.00 $ 31.00. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES standard by JEDEC Solid State Technology Association, 03/01/2008. Add to cart. Category: JEDEC. Description Description. This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are. AEC - Q005 - REV-A June 1, 2010 Component Technical Committee Automotive Electronics Council Page 2 of 8 1.3 Terms and Definitions 1.3.1 Lead Free (Pb-free) Plating Finish: A component plating finish is considered Pb-free if the following requirements are met

RoHS-konforme Halbleiter richtig verarbeite

Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C tS t tP 240 ˚C Tp 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 60 100 120 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to T The latest Revision to the IPC/JEDEC J-Std-033 ensures the integrity of dry packing, protecting moisture-sensitive devices from high humidity during shipment or storage JEDEC J-STD-020D.01. Home; JEDEC; JEDEC J-STD-020D.01; Sale! $ 62.00 $ 31.00. JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES standard by JEDEC Solid State Technology Association, 03/01/2008. Add to cart. NOTE: Our website provide PDF immediately download,sometimes when you purchased can't online download please contact. JEDEC J-STD-020D.01 JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES JEDEC Solid State Technology Association / 01-Mar-2008 / 22 pages More details . PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD $27.28. $62.00 (price reduced by 56 %) Quantity :. Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C tS t tP 240 ˚C Tp 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profile Feature Profil-Charakteristik Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS tL tP TL TP 60 100 120 10 20 30 80 100 217 2 3 245 260 3 6 Time 25 °C to TP Time within 5 °C of.

IPC/JEDEC J-STD-020D-1-2008 - Moisture/Reflow Sensitivity

Title: Ipc J Std 020d Author: accessibleplaces.maharashtra.gov.in-2021-01-15-22-51-55 Subject: Ipc J Std 020d Keywords: ipc,j,std,020d Created Dat Ipc J Std 020d - customerportal.jalan.jaga-me.com Access Free Ipc J Std 020d Ipc J Std 020d It’s worth remembering that absence of a price tag doesn’t necessarily mean that the book is in the public domain; unless explicitly stated otherwise, the author will retain rights over it, including the exclusive right to distribute it

Title: Ipc J Std 020d Author: www.accessibleplaces.maharashtra.gov.in-2021-01-23-18-25-26 Subject: Ipc J Std 020d Keywords: ipc,j,std,020d Created Dat IPC/JEDEC-J-STD-033-PDF Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Component JEDEC Standard 22-A113D Page 3 Test Method A113D (Revision of Test Method A113-C) 3.1 Steps (cont'd) 3.1.1 Initial electrical test Perform electrical dc and functional test to verify that the devices meet the room temperatur

acc. J-STD-020D DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 4 Floor life: 72 J-STD-020D . JESD22-A113 . Peak T at 260° C . 3 IR-reflows . TC . JESD 22 -A104 -50°C/+150°C, 500cyc . 77 x 1 . PC, MSL3 . or MSL1 (2) J-STD-020D . JESD22-A113 . Peak T at 260° C . 3 IR-reflows . HTS . JESD 22 -A103 . 150°C, 500h 77 x 1 . 4 . Notes • (2): MSL1 or MSL3 depending on each package • (3) THB or THS depending on each package • MSL1 Moisture sensitivity level 1 • MSL3. According to J-STD-020D DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: level 3 Floor life: 168 JEDEC J-STD-020D and passed electrical testing, package coplanarity and visual inspection which revealed no external cracks or changes in package body ß atness. Unless otherwise stated all dimensions in inches (mm) ±0.01 (0.25). All pins on a 0.1 (2.54) pitch and within ±0.01 (0.25) of true position

IPC J-STD-020D IPC J-STD-020C IPC J-STD-020B IPC J-STD-020A People Who Bought This Also Bought: IPC J-STD-033B- Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)ISO 7010/Amd6:2010- Graphical symbols - Safety colours and safety signs - Safety signs used in workplaces and public areas - Amendment 6IPC 6013A- Qualification and. J-STD-020D.01; Resistance to solvent (Permanence of marking) *1: IPA: 1 Time: JEITA ED-4701/500

J-STD-020D AcousTech, Inc

J-STD-020D.1, JEDEC, March 2008 A joint IPC/JEDEC standard on the moisture/reflow classification of SMD devices. Though oft cited, note that the standard prescribes the profile in section 5.6 for the purpose of classification of components. It is not necessarily suitable as a production profile 1 Based on JEDEC Standard J -STD 020D.1. 2 For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used. ADXL375 Data Sheet Rev. B | Page 6 of 32 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS . 1 1669-002 CS SDA/SDI/SDIO SDO/ALT ADDRESS RESERVED NC NOTES 1. NC = NOT INTERNALLY CONNECTED. INT2 INT1 V DD I/O GND RESER GND GND. as referenced in JEDEC J-STD 020D RoHS-compatible Applications Filtering of supply voltages, coupling, decoupling DC/DC converters Automotive electronics Telecommunications (e.g. blocking filter for 12- and 16-kHz counting pulses) Consumer electronics Industrial electronics Terminals Base material CuSn

Wikizero - Moisture Sensitivity Leve

260 +0/-5 °C / 30 sec acc. to IPC/JEDEC J-STD-020D, Level 1. Moisture Sensitivity Level. MSL 1, J-STD-020 . Case Resistance. acc. to EIA/IS-722, Test 4.7 >100 MΩ (between leeds and body) Flammability. UL 94V-1 (acc. to EIA/IS-722, Test 4.12) Moisture Resistance Test. MIL-STD-202, Method 106 (50 cycles in a temp./mister chamber) Resistance to Solvents. MIL-STD-202, Method 215. Terminal. The SMD type is in line with J-std-020d humidity sensitive components standards. We acquired UL / EN / IEC 60950-1 related safety certification, to meet the customer industrial /Telecom/railway /IPC application selection or customized products services. Series. Output Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D RoHS-compatible Halogen Free in the meaning of Cl ≤ 900ppm, Br ≤ 900pm, Cl+Br ≤ 1500 ppm Applications Filtering of supply voltages Coupling, decoupling DC/DC converters Automotive electronics Terminals Base materia SOLDERING PROCESS: LEAD-FREE REFLOW SOLDERING IN REFERENCE TO JEDEC J-STD-020D Loetprozess: Bleifreies Loeten in Anlehnung an die JEDEC J-STD-020D TOLERANCES ACC. TO DIN EN ISO 8015, DIN EN ISO 14405-1 GENERAL TOL. ACC. TO DIN 16742 TG5, EXCEPT ANGLE DIM. (SEE TITLE BLOCK) Tolerierung nach DIN EN ISO 8015, DIN EN ISO 14405- • smd package qualified for leadfree reflow solder process according ipc j-std-020d • output voltage programmable from 0.75vdc to 5.0vdc via external resistor • input under-voltage protection • ul60950-1, en60950-1, & iec60950-1 safety approvals • ce marked • compliant to rohs ii & reach. applications • wireless network.

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ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for. MSL classification at lead-free peak reflow temperature. ANPEC defines Green to mean lead-free (RoHS compliant)and halogen. free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by . weight). APL3512. Package Code. B : SOT-23-5. • Meets IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level 1 requirements • REACH and RoHS compliant • Options: Internal diagnostic function, liquid media, sleep mode, temperature output • Sensor materials have been tested and certified for these food safety standards: - NSF-169 - BPA Free - LFGB 32305128 Issue I to aging of the sensor terminals, which minimizes the concern about aging. IPC J-STD-020D Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices standard by Association Connecting Electronics Industries, 08/01/2007. More details. PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD $38.25. $85.00 (price reduced by 55 %) Quantity : More info. profile according to IPC/JEDEC J-STD-020D with peak temperatures at 260°C during up to 40sec including Pb-free assembly in IR/Convection reflow ovens. 1.8 Figure 5: Soldering profile according to JEDEC standard. T P <= 260°C and tP < 40sec for Pb-free assembly. T L < 220°C and tL < 150sec. Ramp-up/down speeds shall be < 5°C/sec process according IPC/JEDEC J-STD-020D Available in tape and reel package 3-year product warranty The TES-1V series are miniature, 1W DC/DC-converters with high isolation in a SMD package. With a new package design these converters are qualified for the higher temperatures requested by lead-free reflow solder processes. With the smal

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